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Premium Vacuum Vapour Phase System
for highest soldering quality
Features
・ Reduction of voids, even for large area soldering
・ Evacuation of the modules in the Vapour Phase
・ During the evacuation (vacuum process) the temperature
will be over liquidus at all times
・ Maximum process window at minimum temperature
(Lead free solder max. temp. 230°C)
・ Maintenance free transport unit. (Patented)
・ Lead and lead free soldering without resetting
・ Online profile monitoring with the IBL VP-Control
・ Can be upgraded to a full automatic
・ Optional In-line-operation-system (Patented)
・ IR heater unit for extended preheating (Patented)
・ Energy management system for lowest energy
consumption
・ No compressed air necessary
・ Lowest consumption of liquid
Vacuum process cycle (Patented)
The combination of the vapour phase soldering process
with a vacuum chamber significantly increases the
reliability of the finished product. The reduction of voids
is of major importance on small solder connections
(such as ! BGA) and on flat soldering connections of
power electronics to improve the heat transfer.
The evacuation process starts before, during or after
reaching liquidus temperature and it during evacuation.
Finally the vacuum process is finished by controlled
flush in of ambient air at the end of the cycle.
| Working principle of the vacuum chamber |
| X-ray of soldering pad without and with vacuum process |
Modes of operation
Heat Level Mode (HL-Mode)
A simple variation of vapour phases soldering,
generates different, nearly linear temperature profiles.
Energy transfer is controlled by adjustable heatin power.
Soft-Vapour-Phase-Mode (SVP-Mode, Patented)
Extremely variable possibility to create reproducible
temperature profiles for different requirements.
Soft-Vapour phase stands for slow stepping into the vapour
phase and the possibility to stay in different positions. Up
and down movements in the vapour phase are freely
programmable.
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Freely programmable
vapour steps allow
optimum adjustments
of heat transfer in 20
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Automatic mode
For the optimization of the solder-process the integrated
premium-solder-automatic can be activated in addition in
both modes. This automatically controls the adaptation of
the solder time or the maximum solder-temperature.
Limitation of the time above liquidus
After the solder temperature is reached a timer will begin.
The solder cycle will finish automatically after the adjusted
time over liquidus.
Documentation
Production data can be stored using the IBL VP-Control
software of IBL.
Standard Equipment / Specification
・ Variable high power vacuum process (Patented)
・ Automatic internal air-lock
・ Automatic carrier in- and output
・ SVP mode for soft temperature rise (Patented)
・ Observation window into process chamber
・ Integrated illumination of the soldering area
・ Redundant check of cooling water temperature
・ Temperature control of heating surface (Thermocouple)
・ Integrated board cooling
・ Automatic fluid level indicator
・ Automatic liquid agent filtering
・ Work piece carrier temperature control and compensation
・ Integrated heat exchanger for minimized drag out of fluid
・ Variable energy level set-up including program storage
・ Maintenance free transportation system (Patented)
・ Integrated heat exchanger and fluid recovery system
・ Automatic or time controlled soldering process (Patented)
Options
・ Display indicator for the height of the vapour level.
・ Serial interface for PC-Adaptation
・ Monitoring software VP-Control for convenient
documentation and fine adjustment of the soldering process
・ Temperature sensors for VP-Control (max. 3 channels)
・ Adapter for easy access of thermocouple plugs on WPC
・ Rapid cooling system (RCS, Patented)
・ Cooling device for closed loop machine cooling
・ ReSy system, for repair of QFP's and BGA's (Patented)
・ Additional Inline-Handling-System (see picture, Patented)
Options can be retrofitted during operation
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Vapour Phase VAC 645/665
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