|
|
 |
Premium Vapour Phase Soldering Series
for highest demands |
Features
・ 2-Chamber Batch-Soldering-Machine
・ Lead and lead free soldering without changeover
・ Maximum process window at minimum temperature(e.g. lead free soldering
at 230℃)
・ Easy and comfortable operation through Touch screen monitor for programming.
・ Maintenance free transport unit (TPS, patented)
・ Live temperature profile monitoring, documentation and optimization
with
IBLSoftwareVP-Control (all data are universally compatible)
・ Optional Fast cooling system (RCS, patented)
・ Optional IR heater unit (ideal for glue hardening)
・ Lowest running cost through energy management system
・ Lowest fluid consumption
・ Fully electric handling without compressed air
Process cycle
Die BLC/SLC series allows the precise processing of
complex PCB boards without time consuming pretesting.
Through combination of the patented IBL Soft-Vapour
Phase with the IBL soldering automatic the system can
run classical vapour phase profiles as well as plateautemperature
profiles by simply selecting the suiting
program from the process library.
During operation the sensor based process control
adjusts the temperature points automatically in order to
provide a reliable soldering result.
Modes of operation
Heat Level Mode (HL-Mode)
HL-Mode is a simple method of Vapour Phase
Soldering. Variable, almost linear temperature profiles
are achieved by adjusting the heating power.
Soft-Vapour-Phase-Mode (SVP-Mode, Patented)
Enables extremely variable and reproducible temperature
profiles to be created for different requirements.
Soft-Vapour phase is the ability to control the speed the
board enters the vapour and hold it at different positions.
The board can be moved up or down within the vapour
chamber. All steps are programmable,
 |
Easily programmable
vapour steps allow
optimum adjustments
of heat transfer in 20
steps
|
Automatic Mode
The solder automatic provides a reliable soldering
performance and optimises the residual time of the
boards in the vapour phase to minimise thermal stress
Limitation of the time above liquidus
After the solder temperature is reached a timer will begin.
The solder cycle will finish automatically after the adjusted
time over liquidous.
Standard Equipment / Specification
・ Machine operation with TFT touch panel
・ 2 process chambers with internal air-lock separation
・ Fully electric carrier in- and output
・ SVP mode for precise adjustment of temperature
profiles (Patented)
・ SVTC ? Temperature based process control
・ Syncro Mode for exact process repeatability
・ Premium solder automatic incl. 4 internal channels for
comfortable temperature measuring and profiling
・ Energy management system incl. program storage
・ Maintenance-free transportation system (Patented)
・ Integrated convection cooling station for board cooling
・ Integrated heat exchanger and fluid recovery system
・ Fluid level monitoring
・ Automatic fluid filtering
・ Redundant monitoring of cooling water temperature
・ Controlled heater area, no overheating
・ Observation window into process chamber with
integrated illumination of the soldering area
Options
・ Rapid cooling system (RCS, Patented)
・ IR heater system with quartz radiator
・ Display indicator for vapour level height
・ Anti Fog System (AFS) for clear vision of the
soldering process (Patented)
・ Adapter for double sided PCB boards
・ Monitoring software VP-Control for convenient
documentation and fine adjustment of the process
・ Inline-Handling-System (see picture, Patented)
・ Cooling device for closed loop machine cooling
|
Vapour Phase SLC/BLC
|
|
