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Features
・ Fully automatic in-line-operation
・ Three internal process chambers with automatic air locks
・ Easy and straightforward programming of the solder data
through the intuitive Touch Screen Display
・ Two independent stations for loading and unloading of
the carriers with Cool Handling System (no moving parts in the process
chamber)
・ A cycle time of under 20 sec per board is possible
・ Parallel Batch and inline operation available
・ Maintenance free transport system (Patented)
・ Energy management system including standby mode for lowest energy consumption
・ Optional IR-Heating (ideal for glue hardening)
・ Optional UPS (uninterrupted power supply)
Modes of operation
Heat Level Mode (HL-Mode)
HL-Mode is a simple method of Vapour Phase
Soldering. Variable, almost linear temperature profiles
are achieved by adjusting the heating power.
Soft-Vapour-Phase-Mode (SVP-Mode, Patented)
Enables extremely variable and reproducible temperature
profiles to be created for different requirements.
Soft-Vapour phase is the ability to control the speed the
board enters the vapour and hold it at different positions.
The board can be moved up or down within the vapour
chamber. All steps are programmable,
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Easily programmable
vapour steps allow
optimum adjustments
of heat transfer in 20
steps
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Automatic Mode
The solder automatic provides a reliable soldering
performance and optimises the residual time of the
boards in the vapour phase to minimise thermal stress
Limitation of the time above liquidus
After the solder temperature is reached a timer will begin.
The solder cycle will finish automatically after the adjusted
time over liquidous.
Documentation
Production data can be stored using the IBL VP-Control
software.
Standard Equipment / Specification
・ Automatic loading and unloading of the carriers
・ Integrated automatic loading and unloading conveyors
・ Automatic adjustment of work piece carrier rails and mid
supports
・ SMEMA-Interface
・ Optional IR unit for extended preheating from above
・ SVP for soft temperature rise (Patented)
・ Observation window to process chamber
・ Integrated lighting of the soldering area
・ Continuous automatic liquid agent filtering
・ Double control for monitoring the cooling water
temperature
・ Temperature control of heater surface with thermocouple
・ Integrated cooling chamber for board cooling
・ Fluid level check and control
・ Automatic Work piece carrier temperature compensation
・ Signal lights post (red-green-blue)
・ Fluid recovery system
・ Variable energy level set-up
・ Maintenance free high-grade steel transportation system(Patented)
・ Patented process procedure
・ Operation of integrated PC with TFT-Panel
Options
・ Siemens-Interface
・ Cooling device for closed loop machine cooling
・ Additional batch carriers for manual operation
・ Additional multi line carrier for 3 lines with middle support
・ UPS (uninterrupted power supply)
・ Full-Traceability option with integrated code scanner
All options can be retro-fitted
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Vapour Phase CM 800
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